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Damage to Wire Bonds after Radiation Exposure

Document #:
BTeV-doc-142-v2
Document type:
Figure/Photo
Submitted by:
David Christian
Updated by:
David Christian
Document Created:
20 Dec 2001, 14:05
Contents Revised:
21 Dec 2001, 16:25
Metadata Revised:
21 Dec 2001, 16:25
Actually Revised:
04 Jan 2002, 09:43
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BTeV-doc-142-v1
20 Dec 2001, 14:05
Abstract:
Three of the four PreFPIX2Tb chips we have tested at IUCF failed some time after irradiation. The failure was caused by a growth on the wire bonds, which separated them from the printed circuit board.
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